View MC10H645FN_744292.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MC10H645 1:9 TTL Clock Driver
Description
The MC10H645 is a single supply, low skew, TTL I/O 1:9 Clock Driver. Devices in the H600 clock driver family utilizes the PLCC-28 for optimal power and signal pin placement. The device features a 24 mA TTL output stage with AC performance specified into a 50 pF load capacitance. A 2:1 input Mux is provided on chip to allow for distributing both system and diagnostic clock signals or designing clock redundancy into a system. With the SEL input held LOW the DO input will be selected, while the D1 input is selected when the SEL input is forced HIGH.
Features
http://onsemi.com
* * * * * * *
Low Skew Typically 0.65 ns Within Device Guaranteed Skew Spec 1.25 ns Part-to-Part Input Clock Muxing Differential ECL Internal Design Single Supply Extra TTL and ECL Power/Ground Pins Pb-Free Packages are Available*
PLCC FN SUFFIX CASE 776
MARKING DIAGRAM
MC10H645G AWLYYWW
A WL YY WW G
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
February, 2006 - Rev. 6
1
Publication Order Number: MC10H645/D
MC10H645
TTL Outputs TTL Inputs MUX D0 D0 D0 D1 D1 S SEL S Q0 Q1 Q Q Q3 Q4 Q5 Q6 Q7 Q2 GT Q5 VT Q4 VT Q3 GT 26 27 28 1 2 3 4 5 GT 6 Q2 7 VT 8 Q1 9 VT 10 Q0 11 GT GT 25 Q6 24 VT 23 Q7 22 VT 21 Q8 20 GT 19 18 17 16 15 14 13 12 NC D0 D1 VE SEL GE NC
D1
Figure 1. Logic Diagram
Q8
Figure 2. Pinout: 28-Lead PLCC (Top View)
Table 1. PIN NAMES
PIN GT VT VE GE Dn Q0 - Q8 SEL TTL Ground (0 V) TTL VCC (+5.0 V) ECL VCC (+5.0 V) ECL Ground (0 V) TTL Signal Input TTL Signal Outputs TTL Mux Select FUNCTION
Table 2. PIN DESCRIPTIONS
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Symbol Q4 VT Q3 GT GT Q2 VT Q1 VT Q0 GT NC GE SEL Description Signal Output (TTL) TTL VCC (+5.0 V) Signal Output (TTL) TTL Ground (0 V) TTL Ground (0 V) Signal Output (TTL) TTL VCC (+5.0 V) Signal Output (TTL) TTL VCC (+5.0 V) Signal Output (TTL) TTL Ground (0 V) No Connection ECL Ground Select Input (TTL) Pin 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Symbol VE D1 D0 NC GT Q8 VT Q7 VT Q6 GT GT Q5 VT Description ECL VCC (+5.0 V) Signal Input (TTL) Signal Input (TTL) No Connection TTL Ground (0 V) Signal Output (TTL) TTL VCC (+5.0 V) Signal Output (TTL) TTL VCC (+5.0 V) Signal Output (TTL) TTL Ground (0 V) TTL Ground (0 V) Signal Output (TTL) TTL VCC (+5.0 V)
Table 3. TRUTH TABLE
D0 L H X X D1 X X L H SEL L L H H Q L H L H
http://onsemi.com
2
MC10H645
Table 4. ABSOLUTE RATINGS (Do not exceed)
Symbol VE (ECL) VT (TTL) VI (TTL) Vout Tstg Tamb Characteristic Power Supply Voltage Power Supply Voltage Input Voltage Disabled 3-State Output Storage Temperature Operating Temperature Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 0.0 to VT -65 to 150 0.0 to +85 Unit V V V V C C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Table 5. DC CHARACTERISTICS (VT = VE = 5.0 V 5%)
0C Symbol IEE ICCH ICCL VOH VOL IOS Output HIGH Voltage Output LOW Voltage Output Short Circuit Current -100 2.5 2.0 0.5 -225 -100 Characteristic Power Supply Current ECL TTL Min Max 30 30 35 2.5 2.0 0.5 -225 -100 Min 25C Max 30 30 35 2.5 2.0 0.5 -225 Min 85C Max 30 30 35 Unit mA mA mA V V mA IOH = -3.0 mA IOH = -15 mA IOL = 24 mA VOUT = 0 V Condition VE Pin Total all VT pins
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
Table 6. TTL DC CHARACTERISTICS (VT = VE = 5.0 V 5%)
0C Symbol VIH VIL IIH IIL VOH VOL VIK IOS Characteristic Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current Output HIGH Voltage Output LOW Voltage Input Clamp Voltage Output Short Circuit Current -100 2.5 2.0 0.5 -1.2 -225 -100 Min 2.0 Max 0.8 20 100 -0.6 2.5 2.0 0.5 -1.2 -225 -100 Min 2.0 25C Max 0.8 20 100 -0.6 2.5 2.0 0.5 -1.2 -225 Min 2.0 85C Max 0.8 20 100 -0.6 Unit V mA mA V V V mA VIN = 2.7 V VIN = 7.0 V VIN = 0.5 V IOH = -3.0 mA IOH = -24 mA IOL = 24 mA IIN = -18 mA VOUT = 0 V Condition
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com
3
MC10H645
Table 7. AC CHARACTERISTICS (VT = VE = 5.0 V 5%)
0C Symbol tPLH tPLH tPHL Propagation Delay D0 to Output Only Propagation Delay D1 to Output Propagation Delay D0 to Output D1 to Output Part-to-Part Skew D0 to Output Only Within-Device Skew D0 to Output Only Propagation Delay SEL to Q Output Rise/Fall Time 0.8V to 2.0V Setup Time SEL to D Q0-Q8 Q0-Q8 4.5 0.5 0.5 1.0 Characteristic Q0-Q8 Min 4.8 4.8 Max 5.8 5.8 25C Min 4.8 4.8 Max 5.8 5.8 85C Min 5.2 5.2 Max 6.2 6.2 Unit ns ns ns Condition CL = 50 pF
4.8 4.8
5.8 5.8 1.0 0.65 6.5 2.5 2.5
4.8 4.8
5.8 5.8 1.0 0.65
5.2 5.2
6.2 6.2 1.0 0.65
tskpp tskwd* tPLH tr tf tS
ns ns ns ns ns CL = 50 pF CL = 50 pF
5.0 0.5 0.5 1.0
7.0 2.5 2.5
5.2 0.5 0.5 1.0
7.2 2.5 2.5
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. *Within-Device Skew defined as identical transitions on similar paths through a device.
Table 8. DUTY CYCLE SPECIFICATIONS (0C TA 85C; Duty Cycle Measured Relative to 1.5 V)
Symbol PW Characteristic Range of VCC and CL to Meet Min Pulse Width (HIGH or LOW) at fout 50MHz VCC CL PW Min 4.875 10.0 9.0 Nom 5.0 Max 5.125 50.0 11.0 Unit V pF ns Condition All Outputs
ORDERING INFORMATION
Device MC10H645FN MC10H645FNG MC10H645FNR2 MC10H645FNR2G Package PLCC-28 PLCC-28 (Pb-Free) PLCC-28 PLCC-28 (Pb-Free) Shipping 37 Units / Rail 37 Units / Rail 500 / Tape & Reel 500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
http://onsemi.com
4
MC10H645
PACKAGE DIMENSIONS
PLCC-28 FN SUFFIX CASE 776-02 ISSUE E
-N- Y BRK D Z -L- -M- B 0.007 (0.180) U
M
T L-M
M
S
N
S S
0.007 (0.180)
T L-M
N
S
W
28 1
D
V
X VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R E G G1 0.010 (0.250)
S
0.007 (0.180) 0.007 (0.180)
M M
T L-M T L-M
S S
N N
S S
H
0.007 (0.180)
M
T L-M
S
N
S
C
K1 0.004 (0.100) -T- SEATING
PLANE
J
K F VIEW S 0.007 (0.180)
M
VIEW S T L-M
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10_ 0.410 0.430 0.040 ---
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10_ 10.42 10.92 1.02 ---
http://onsemi.com
5
MC10H645
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
http://onsemi.com
6
MC10H645/D

▲Up To Search▲

Price & Availability of MC10H645FN

	To Download MC10H645FN Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .